M2GL050TS-1FCS325 Advanced Packaging: 2397-FBGA (50x50mm) flip-chip

Advanced Packaging: 2397-FBGA (50x50mm) flip-chip ball grid array for superior thermal performance and signal integrity

Technical Advantages

The APA300-FG144I is a high-performance Field Programmable Gate Array (FPGA) from Microchip Technology's renowned ProASICPLUS family

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M2GL050TS-1FCS325 Advanced Packaging: 2397-FBGA (50x50mm) flip-chipProduct attributes Property Value Manufacturer Microchip Technology Product Series IGLOO2 Description IC FPGA 200 I O 325BGA Packaging Tray Tray Number of LABs CLBs Number of Logic Elements Cells 56340 Mounting Type Surface Mount Operating temperature 0C ~ 85CTJ Total RAM Bits 1869824 Number of I O 200 Number of Gate Voltage Supply 1. 14V ~ 2. 625V Grade Qualification B Package Case 325 TFBGAFCBGA Supplier Device Package 325 FCBGA11x11